Descrizione
ESD PC 3D Printing Filament | Made in the USA | Reliable and Clean ESD Protection
3DXSTAT™ ESD PC is an advanced ESD-safe compound designed for use in critical applications requiring electrostatic discharge (ESD) protection. Manufactured using cutting-edge multi-walled carbon nanotube technology, advanced compounding technology, and precision extrusion processes. Target surface resistance of 10^7 to 10^9 Ohms.
The advantages of polycarbonate (PC) include:
- High thermal properties including a Tg of 147°C
- The amorphous structure gives low, nearly isotropic shrinkage
- Excellent ductility and impact resistance
- Very low odor emitted during printing
- Wide working range of 265-300°C
The benefits of 3DXSTAT™ include:
- Constant surface resistivity
- Better impact retention and stretch
- Low particulate contamination
- Minimal contribution to outgassing and ionic contamination
Typical ESD applications for PCs include:
Semiconductor: HDD components, wafer handling, masks, enclosures and connectors
Industrial: transportation, measurement and sensing applications
3DXSTAT ESD PC Target Conductivity:
Surface resistivity from 10^7 to 10^9 ohms on 3DP sample using the concentric ring test method.
Note: Internal studies have shown that increasing extruder temperatures can achieve higher levels of conductivity. Similarly, lower extruder temperatures have resulted in lower levels of conductivity. Each printer is configured differently, not to mention the varying geometry of its parts. Therefore, expect some testing time to understand how ESD PC filament works in your specific printer and application.
Surface conductivity as a function of extruder temperature:
The surface resistance of your printed ESD PC part varies depending on the printer's extruder temperature. For example, if tests indicate that the part is too insulating, increasing the extruder temperature will result in better conductivity. Therefore, the surface resistance can be "dialed in" by adjusting the extruder temperature up or down depending on the reading you receive from your part.
Recommended print settings:
- Extruder: 260-300°C
- Bed temperature: 110-120°C
- Bed Prep: Magigoo Bed Prep or 3DXTECH Polyimide Tape Gives Us the Best Results
- Heated chamber: Recommended, a chamber helps reduce warping and improves layer adhesion
- Supports: The water-soluble USM AquaTek™ X1 Universal Support Material is ideal for complex parts
- Drying instructions: 120°C for 4 hours.
