Intamsys FUNMAT PRO 310 Apollo

FUNMAT PRO 310 NEO
Bring industrial performance to your desktop

Chamber up to 100 °C

The active heated chamber maintains a constant temperature up to 100°C, optimizing material properties and mechanical strength for a wide range of engineering plastics.

Next-generation printing motherboard, driving high-speed printing innovation
Powered by NXP's advanced MCU, this motherboard provides the robust processing power needed for high-speed printing.

Perfect surface finish with advanced motion control algorithms
Intelligent Speed ​​Prediction: Predicts print speeds based on path complexity to maintain exceptional surface quality even with complex feature structures.

Flow Compensation Technology: Dynamically adjusts material extrusion speed to prevent surface defects during high-speed printing.

Full-Format Printing
Reduces thermal deformation and model shrinkage during the printing process, preventing warping to achieve large format prints (305 x 260 x 260 mm).

PC Print
The 100°C heated chamber prevents warping, delamination and deformations in long-edge PC prints greater than 150mm.

Superior mechanical properties
High-temperature semi-crystalline structures provide increased strength and toughness.
Constant chamber temperatures ensure consistent mechanical performance.

NEW INTAMSUITE NEO SLICING SOFTWARE
Automated slicing for model design and repair. All-in-one collaborative additive manufacturing platform for online monitoring and optimization of the printing process.